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  document number: mc33996 rev. 6.0, 6/2007 freescale semiconductor advance information * this document contains certain information on a new product. specifications and information herein are subject to change without notice. ? freescale semiconductor, in c., 2007. all rights reserved. 16-output switch with spi control the 33996 is a 16-output low-side sw itch with a 24-bit serial input control. it is designed for a variety of applications including inductive, incandescent, and led loads. the seri al peripheral interface (spi) provides both input control and diagnostic readout. a pulse width modulation (pwm) control input is provided for pulse width modulation of multiple outputs at the same duty cycle. a dedicated reset input provides the ability to clear all internal registers and turn all outputs off. the 33996 directly interfaces with micro controllers and is compatible with both 3.3 v and 5.0 v cmos logic levels. the 33996, in effect, serves as a bus expander and buffer with fault management features that reduce the mcu?s fault management burden. features ? designed to operate 5.0 v < v pwr < 27 v ? 24-bit spi for control and fault reporting, 3.3 v/5.0 v compatible ? outputs are current limited (0.9 a to 2.5 a) to drive incandescent lamps ? output voltage clamp of +50 v during inductive switching ? on/off control of open load detect current (led application) ?v pwr standby current < 10 a ?r ds(on) of 0.55 ? at 25c typical ? independent overtem perature protection ? output selectable for pwm control ? output on short-to-v bat and off short-to-ground /open detection ? pb-free packaging designated by suffix code ek figure 1. 33996 simplified application diagram low side switch 33996 ordering information device temperature range (t a ) package mc33996ek/r2 -40c to 125c 32 soicw-ep MCZ33996EK/r2 ek suffix (pb-free) 98arl10543d 32-pin soicw exposed pad v pwr mcu 33996 led lamp solenoid/relay vdd 3.3 v/5.0 v vdd vpwr gnd out15 out0 out1 out2 out3 out4 out5 out6 out7 out8 out9 out10 out11 out12 out13 out14 v bat sopwr so mosi pwm pwm si miso cs cs sclk sclk rst rst /8
analog integrated circuit device data 2 freescale semiconductor 33996 iinternal block diagram iinternal block diagram figure 2. 33996 simplified internal block diagram i limit out0 r s short and open load detect overtemperature detect si sclk v dd gate control 50 v gnd (8) voltage regulator input buffers ovd rb sfpdb sclk cs si so csi csbi to gates 1 to 15 from detectors 1 to 15 vpwr spi interface logic ot sf of 10 a 25 a bias 10 a 10 a sfl v dd s opwr 10 a open load detect enable overvoltage detect ge v dd serial d/o line driver pwm rst cs so v ref 50 a out1-15
analog integrated circuit device data freescale semiconductor 3 33996 pin connections pin connections figure 3. 33996 pin locations table 1. pin definitions a functional description of each pin can be found in the functional pin description section beginning on page 10 . pin pin name formal name definition 1, 2, 4, 5, 12, 13, 15 ? 18, 20, 21, 28, 29, 31, 32 out0 ? out15 output 0 ? output 15 open drain output pin. 3 so pwr so pwr supply power supply pin to the so output driver. 6 v pwr battery input battery supply input pin. 7? 10, 23 ? 26 gnd ground ground for logic, analog, and power output devices. 11 sclk system clock system clock for internal shift registers of the 33996. 14 cs chip select spi control chip select input pin from the mcu to the 33996. 19 si serial input serial data input pin to the 33996. 22 so serial output serial data output pin. 27 rst reset active low reset input pin. 30 pwm pwm control pwm control input pin. supports pwm on any combination of outputs. out15 1 out12 rst gnd gnd gnd gnd so out11 out10 out9 out8 si out13 out14 pwm out0 out3 vpwr gnd gnd gnd gnd sclk out4 out5 out6 out7 cs out2 out1 sopwr 8 9 10 11 12 13 14 15 16 3 4 5 6 7 2 32 25 24 23 22 21 20 19 18 17 30 29 28 27 26 31
analog integrated circuit device data 4 freescale semiconductor 33996 electrical characteristics maximum ratings electrical characteristics maximum ratings table 2. maximum ratings all voltages are with respect to ground unless otherwise noted. rating symbol value unit electrical ratings v pwr supply voltage (1) v pwr -1.5 to 50 v so output driver power supply voltage (1) so pwr -0.3 to 7.0 v spi interface logic input voltage ( cs , pwm, si, so, sclk, rst ) (1) v in -0.3 to 7.0 v output drain voltage v d -0.3 to 45 v frequency of spi operation (2) f spi 6.0 mhz output clamp energy (3) e clamp 50 mj esd voltage (4) human body model machine model v esd1 v esd2 2000 200 v thermal ratings operating temperature ambient junction case t a t j t c -40 to 125 -40 to 150 -40 to 125 c storage temperature t stg -55 to 150 c power dissipation (t a = 25 c) (5) p d 1.7 w peak package reflow temperature during reflow (6) , (7) t pprt note 7 c thermal resistance junction-to-ambient (8) junction- to-lead (9) junction-to-flag r ja r jl r jc 75 8.0 1.2 c/w notes 1. exceeding these limits may cause malf unction or permanent damage to the device. 2. this parameter is guaranteed by design but not production tested. 3. maximum output clamp energy capability at 150 c junction temperature using si ngle nonrepetitive pulse method. 4. esd data available upon request. esd testing is performed in accordance with the human body model (c zap = 100 pf, r zap = 1500 ? ) and the machine model (c zap = 200 pf, r zap = 0 ? ). 5. maximum power dissipation with no heat sink used. 6. pin soldering temperature limit is for 10 seconds maximum durat ion. not designed for immersion so ldering. exceeding these lim its may cause malfunction or permanent damage to the device. 7. freescale?s package reflow capability meets pb-free requirem ents for jedec standard j-std-020c. for peak package reflow temperature and moisture sensitivity levels (msl), go to www.freescale.com, search by part number [e.g. remove prefix es/suffixes and enter the core id to view all orderable parts . (i.e. mc33xxxd enter 33xxx), and review parametrics. 8. tested per jedec test jesd52-2 (single-layer pwb). 9. tested per jedec test jesd51-8 (two-layer pwb).
analog integrated circuit device data freescale semiconductor 5 33996 electrical characteristics static electrical characteristics static electrical characteristics table 3. static electrical characteristics characteristics noted under conditions 3.1 v so pwr 5.5 v, 5.0 v v pwr 18 v, -40 c t a 125 c unless otherwise noted. where applicable, typical values noted refl ect the parameter ?s ap proximate value with v pwr = 13 v, t a = 25 c. characteristic symbol min typ max unit power supply (vpwr) supply voltage range fully operational v pwr (fo) 5.0 ? 27 v supply current all outputs on, i out = 0.3 a i pwr (on) ? 4.0 8.0 ma sleep state supply current at rst 0.8 and/or so pwr 1.5 v i pwr (ss) _ 1.0 10 a overvoltage shutdown v ov 27.5 31.5 35 v overvoltage shutdown hysteresis v ov ( hys ) 0.6 1.4 2.3 v vpwr undervoltage shutdown v pwr (uv) ? 3.2 4.0 v spi interface logic supply voltage so pwr 3.1 ? 5.5 v spi interface logic supply current ( rst pin high) i sopwr( rst h) 100 ? 500 a spi interface logic supply current ( rst pin low) i sopwr( rst l) -10 ? 10 a spi interface logic supply undervoltage lockout threshold so pwr ( unvol ) 1.5 2.5 3.0 v power output (vpwr) drain-to-source on resistance ( i out = 0.35 a, v pwr = 13 v) t j = 125 c t j = 25 c t j = -40 c r ds(on) ? ? ? 0.75 0.55 0.45 1.1 ? ? ? output self-limiting current outputs programmed on i out ( lim ) 0.9 1.2 2.5 a output fault detect threshold (10) outputs programmed off v outth (f) 2.5 3.0 3.5 v output off open load detect current (11) outputs programmed off (v pwr = 5.0 v, 13 v, 18 v) i oco 25 50 100 a output clamp voltage i out = 20 ma v cl 45 50 55 v output leakage current so pwr 1.5 v, v out 1-16 = 18.0 v i out( lkg ) -10 2.0 10 a overtemperature shutdown (outputs off) (12) t lim 155 165 180 c overtemperature shutdown hysteresis (12) t lim ( hys ) 5.0 10 20 c notes 10. output fault detect thresholds with outputs programmed off. output fault detect thresholds are the same for output open and shorts. 11. output off open load detect current is the current required to flow through the load for th e purpose of detecting the existe nce of an open load condition when the specific output is commanded to be off. 12. this parameter is guaranteed by design; however, it is not production tested.
analog integrated circuit device data 6 freescale semiconductor 33996 electrical characteristics static electrical characteristics digital interface ( rst , si, cs , sclk, so, pwm) input logic voltage thresholds (13) v inlogic 0.8 ? 2.2 v input logic voltage thresholds for rst v in rst 0.8 ? 2.2 v si pull-down current si = 5.0 v i si 2.0 10 30 a cs pull-up current cs = 0 v i cs -30 -10 -2.0 a sclk pull-down current sclk = 5.0 v i sclk 2.0 10 30 a rst pull-down current rst = 5.0 v i rst 5.0 25 50 a pwm pull-down current i pwm 2.0 10 30 a so high state output voltage i so-high = -1.6 ma v soh so pwr - 0.4 so pwr - 0.2 ? v so low state output voltage i so-low = 1.6 ma v sol ? ? 0.4 v input capacitance on sclk, si, tri-state so, rst (14) c in ? ? 20 pf notes 13. upper and lower logic threshol d voltage levels apply to si, cs , sclk, and pwm. 14. this parameter is guaranteed by design; however, it is not production tested. table 3. static electrical characteristics characteristics noted under conditions 3.1 v so pwr 5.5 v, 5.0 v v pwr 18 v, -40 c t a 125 c unless otherwise noted. where applicable, typical values noted refl ect the parameter ?s ap proximate value with v pwr = 13 v, t a = 25 c. characteristic symbol min typ max unit
analog integrated circuit device data freescale semiconductor 7 33996 electrical characteristics dynamic electrical characteristics dynamic electrical characteristics table 4. dynamic electrical characteristics characteristics noted under conditions of 3.1 v so pwr 5.5 v, 5.0 v v pwr 18 v, -40 c t a 125 c unless otherwise noted. where applicable, typical values reflect the parameter?s approximate average value with v pwr = 13 v, t a = 25 c. characteristic symbol min typ max unit power output timing (vpwr) output slew rate r l = 60 ? (15) sr 1.0 2.0 10 v/ s output turn on delay time (16) t dly (on) 1.0 2.0 10 s output turn off delay time (16) t dly (off) 1.0 4.0 10 s output on short fault disable report delay (17) t dly (short) 100 ? 450 s output off open fault delay time (17) t dly (open) 100 ? 450 s output pwm frequency t freq ? ? 2.0 khz digital interface timing ( cs , so, si, sclk) (23) required low state duration on v pwr for reset v pwr 0.2 v (18) t rst ? ? 10 s falling edge of cs to rising edge of sclk required setup time t lead 100 ? ? ns falling edge of sclk to rising edge of cs required setup time t lag 50 ? ? ns si to falling edge of sclk required setup time t si ( su ) 16 ? ? ns falling edge of sclk to si required hold time t si ( hold ) 20 ? ? ns si, cs , sclk signal rise time (19) t r (si) ? 5.0 ? ns si, cs , sclk signal fall time (19) t f (si) ? 5.0 ? ns time from falling edge of cs to so low impedance (20) t so ( en ) ? ? 50 ns time from rising edge of cs to so high impedance (21) t so ( dis ) ? ? 50 ns time from rising edge of sclk to so data valid (22) t valid ? 25 80 ns notes 15. output slew rate measured across a 60 ? resistive load. 16. output turn on and off delay time measured from 50% rising edge of cs to 80% and 20% of initial voltage. 17. duration of fault before fault bit is set. dura tion between access times must be greater than 450 s to read faults. 18. this parameter is guaranteed by design; however, it is not production tested. 19. rise and fall time of incoming si, cs , and sclk signals suggested for design considerat ion to prevent the occurrence of double pulsing. 20. time required for valid output stat us data to be available on so pin. 21. time required for output states data to be terminated at so pin. 22. time required to obtain valid data out from so following the rise of sclk with 200 pf load. 23. this parameter is guaranteed by design. production test equipment used 4.16 mhz, 5.5 v/3.1 v spi interface.
analog integrated circuit device data 8 freescale semiconductor 33996 electrical characteristics timing diagram timing diagram figure 4. spi timing characteristics sclk si msb in cs t 0.2 v dd 0.2 v dd 0.7 v dd so msb out lsb out t so(en ) t si(su ) t si(hold) t t t so(dis ) v tri-state 0.2 v 0.7 v dd 0.2 v dd 0.7 v dd dd lead valid lag
analog integrated circuit device data freescale semiconductor 9 33996 electrical characteristics electrical performance curves electrical per formance curves figure 5. i pwr vs. temperature figure 6. sleep state i pwr vs. temperature figure 7. r ds(on) vs. temperature figure 8. r ds(on) vs. v pwr 0 25 50 100 125 -40 75 -25 i pwr current into v pwr pin (ma) 2 4 6 8 10 12 14 t a, ambient temperature ( c) v pwr @ 13 v 0 25 50 100 125 -40 75 -25 sleep state i pwr versus temperature i pwr current into v pwr pin (ua) 2 4 6 8 10 12 14 t a ambient tem p erature 0 25 50 100 125 -40 75 -25 i pwr current into v pwr pin (a) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 t a, ambient temperature ( c) v pwr @ 13 v 0 25 50 100 125 -40 75 -25 0.4 0.6 0.8 1.0 1.2 1.4 t a, ambient temperature ( c) v pwr @ 13 v r ds(on) ( ? ) 0.2 0.4 0.6 1.0 1.2 v pwr (v) 5 10152025 0 r ds(on) ( ? ) 0.8 1.4 t a = 25 c t a = 125 c t a = -40 c
analog integrated circuit device data 10 freescale semiconductor 33996 functional description functional pin description functional description the 33996 is designed and developed for automotive and industrial applications. it is a 16-output power switch having 24-bit serial control. the 33996 incorporates smartmos technology having cmos logic, bipolar / mos analog circuitry, and independent dmos power output transistors. many benefits are realized as a direct result of using this mixed technology. a simplified internal block diagram of the 33996 is shown in figure 2 , page 2 . functional pin description chip select ( cs ) the system mcu selects the 33996 to be communicated with through the use of the chip select ( cs ) pin. when the cs pin is in a logic low state, data can be transferred from the mcu to the 33996 and vise versa. clocked-in data from the mcu is transferred from the 33996 shift register and latched into the power outputs on the rising edge of the cs signal. on the falling edge of the cs signal, output fault status information is transferred from the power outputs status register into the device?s so sh ift register. the so pin output driver is enabled when cs is low, allowing information to be transferred from the 33996 to the mcu. to avoid any spurious data, it is essential the high-to-low transition of the cs signal occur only when sclk is in a logic low state. system clock (sclk) the system clock (sclk) pin clocks the internal shift registers of the 33996. the seri al input (si) pin accepts data into the input shift register on the falling edge of the sclk signal, while the serial output (so) pin shifts data information out of the shift register on the rising edge of the sclk signal. false clocking of the shift register must be avoided, ensuring validity of data. it is essential that the sclk pin be in a logic low state whenever the cs pin makes any transition. for this reason, it is recommended, t hough not necessary, that the sclk pin is commanded to a low logic state as long as the device is not accessed ( cs in logic high state). when the cs is in a logic high state, any signal at the sclk and si pins is ignored and the so is tri-stated (high impedance). serial input (si) the serial input (si) pin is used to enter one of seven serial instructions into the 33996 . si spi bits are latched into the input shift register on each falling edge of sclk. the shift register is full after 24 bits of information are entered. the 33996 operates on the command word on the rising edge of cs . to preserve data integrity, exercise care not to transition si as sclk transitions from high to low state (see figure 4 , page 8 ). serial output (so) the serial output (so) pin tran sfers fault status data from the 33996 to the mcu. the so pi n remains tri-state until the cs pin transitions to a logic low state. all faults on the 33996 are reported to the mcu as logic [1]. conversely, normal operating outputs with nonfault ed loads are reported as logic [0]. on the falling edge of the cs signal, output fault status information is transferred from the power outputs status register into the device ?s so shift register. the first eight positive transitions of sclk will provide any fault (bit 23), over-voltage fault (bit 22), followed by six logic [0]s (bits 21 to 16). the next 16 successive positive transitions of sclk provides fault status for output 15 to output 0. refer to the logic operation section (below) for more information. the si / so shifting of data follo ws a first-in, first- out protocol, with both input and output words transferring the most significant bit (msb) first. output driver power supply (sopwr ) the sopwr pin is used to supply power to the 33996 so output driver and power-on reset (por) circuit. to achieve low standby current on vpwr supply, power must be removed from the sopwr pin. the 33996 will be in reset with all drivers off when so pwr is below 2.5 v. the 33996 does not detect over-voltage on the sopwr supply pin. output/input (out0 ? out15) these pins are low-side output switches controlling the load. reset ( rst ) the reset ( rst ) pin is the active low reset input pin used to turn off all outputs, thereby clearing all internal registers. battery input (vpwr ) the vpwr pin is used as the input power source for the 33996. the voltage on vpwr is monitored for over-voltage protection and shutdown. an over-voltage condition (> 50 s) on the vpwr pin will cause the 33996 to shut down all outputs until the over-voltage condition is removed. upon return to normal input voltage, the outputs will respond as programmed by the over-voltage bit in the global shutdown / retry control register. the over-voltage threshold on the vpwr pin is specified as 27.5 v to 35 v with 1.4 v typical hysteresis. following an ove r-voltage shutdown of output drivers, the over-voltage fault and the any fault bits in the so bit stream will be logic [1]. pwm control (pwm) the pwm control pin is provided to support pwm of any combination of outputs. the logic operation section describes the logi c for pwm control.
analog integrated circuit device data freescale semiconductor 11 33996 functional description operational modes operational modes on each spi communication, a 24-bit command word is sent to the 33996 and 24-bit fault word is received from the 33996. the most significant bit (msb) is sent and received first. command register definition: 0 = output command off 1 = output command on so definition: 0 = no fault 1 = fault mcu interface description in operation the 33996 functions as a 16-output serial switch serving as a microcontroller (mcu) bus expander and buffer with fault management and fault reporting features. in doing so, the device directly relieves the mcu of the fault management functions. the 33996 directly interfaces to an mcu and operates at system clock serial frequencies up to 6.0 mhz using a serial peripheral interface (spi) for control and diagnostic readout. figure 9 shows the basic spi configuration between an mcu and one 33996. figure 9. 33996 spi interface with microcontroller all inputs are compatible with 3.3 v / 5.0 v cmos logic levels and incorporate positiv e logic. an input that is programmed to a logic low state (< 0.8 v) will have the corresponding output off. conversely, an input programmed to a logic high state (> 2.2 v) will have the table 5. fault operation serial output (so) pins reports overtemperature fault reported by serial output (so) pin. overcurrent so pin reports short to battery/supply or overcurrent condition. output ?on? open load fault not reported. output ?off?? open load fault so pin reports output ?off?? open load condition. device shutdowns overvoltage total device shutdown at v pwr = 27.5 v to 35 v. resumes normal operation with proper voltage. upon recovery all outputs assume previous state or off based on the overvoltage bit in the global shutdown/retry control register. overtemperature only the output experiencing an overtemperature f ault shuts down. output may auto-retry or remain off according to the control bits in the global shutdown/retry control register. overcurrent output will remain in current limit 0.9 a to 2.5 a until thermal limit is reached. when thermal limit is reached, device will enter overtemperature shutdow n. output will operate as programmed in the global shutdown/retry control register. faul t flag in so response word will be set. 33996 mc68hcxx microcontroller receive buffer parallel ports to logic 24-bit shift register shift register mosi si miso so sclk rst cs pwm
analog integrated circuit device data 12 freescale semiconductor 33996 functional description operational modes output being controlled on. diagnost ics is treated in a similar manner ? outputs with a fault will feedback (via so) to the mcu a logic [1], while normal operating outputs will provide a logic [0]. the 33996 may be controlled and provide diagnostics using a daisy chain configuration or in parallel mode. figure 10 shows the daisy chain configuration using the 33996. data from the mcu is clocked daisy chain through each device while the chip select bit ( cs ) is commanded low by the mcu. during each clock cycle, output status from the daisy-chained 33996s is being transferred back to the mcu via the master in slave out (miso) line. on rising edge of cs , data stored in the input register is transferred to the output driver. daisy chain control of the 33996 requires 24 bits per device. multiple 33996 devices can be controlled in a parallel input fashion using the spi. figure 11 , page 12 , illustrates potentially 32 loads being controlled by two dedicated parallel mcu ports used for chip select. figure 10. 33996 spi system daisy chain figure 11. parallel inputs spi control mc68hcxx microcontroller 33996 shift register ports parallel 33996 si so sclk cs rst pwm miso sclk pwm1 pwm2 mosi si so sclk cs rst pwm parallel ports mc68hcxx microcontroller 33996 33996 si sclk cs si so sclk cs sclk miso mosi shift register so pwm1 pwm rst pwm pwm2 rst
analog integrated circuit device data freescale semiconductor 13 33996 logic commands and registers introduction logic commands and registers introduction the 33996 provides flexible control of 16 low-side driver outputs. the device allows pwm and on /off control through the use of several 24-b it input command words. this section describes the logic operation and command registers of the 33996. the 33996 message set consists of seven messages as shown in table 6 . bits 23 through18 determine the specific command and bits 15 through 0 determine how a specific output will operate. the 33996 operates on the command word on the rising edge of cs . note upon power-on reset all bits are defined as shown in table 6 . on/off control register to program the 16 outputs of the 33996 on or off, a 24-bit serial stream of data is entered into the si pin. the first 8 bits of the control word are used to identify the on/off command and the remaining 16 bits are used to turn on or off the specific output driver. open load current enable control register the open load current enabl e control register is provided to enable or disable the 50 a open load detect pull- down current. this feature allows the device to be used in led applications. power-on reset (por) or the rst pin or the reset command disables the 50 a pull-down current. no open load fault will be re ported with the pull-down current disabled. for open load to be active, the user must program the open load current enable control register with logic [1]. global shutdown/retry control register the global shutdown/retry control register allows the user to select the global fault strategy for the outputs. the over-voltage control bit (bit 16) sets the operation of the outputs when returning from over-voltage. setting the over- voltage bit to logic [0] will force all outputs to remain off when v pwr returns to normal level. setting the over-voltage bit to logic [1] will command outputs to re sume their previous state when v pwr returns to normal level. bit 17 is the global thermal bit. when bit 17 is set to logic [0], all outputs will shut down when thermal limit is reached and remain off even after cooled. with bit 17 set to logic [1], all outputs will shut down when thermal limit is reached and will retry when cooled. short fault protect disable (sfpd) control register all outputs contain current limit and thermal shutdown with programmable retry. the sfpd control bits are used for fast shutdown of the output wh en overcurrent condition is detected but thermal shutdown has not been achieved. the sfpd control register allows the user to select specific outputs for incandescent lamp loads and specific outputs for inductive loads. by programming the specific sfpd bit as logic [1], output will rely on over temperature shutdown only. programming the specific sfpd bit as logic [0] will shut down the output after 100 s to 450 s during turn on into short circuit. the decision for shutdown is table 6. spi control commands msb bits lsb commands 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 on/off control 0 = off, 1 = on 0 0 0 0 0 0 x x 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 open load current enable 0 = disable, 1 = enable 0 0 0 0 0 1 x x 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 global shutdown/retry control 0 = shutdown, 1 = retry 0 0 0 0 1 0 thermal bit 0 over- voltage 0 x x x x x x x x x x x x x x x x sfpd control 1 = therm only, 0 = v ds 0 0 0 0 1 1 x x 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 pwm enable 0 = spi only, 1 = pwm 0 0 0 1 0 0 x x 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 and/or control 0 = pwm pin and with spi 1 = pwm pin or with spi 0 0 0 1 0 1 x x 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 reset 0 0 0 1 1 0 x x x x x x x x x x x x x x x x x x so response 0 = no fault, 1 = fault any fault over - volt - age 0 0 0 0 0 0 out 15 out 14 out 13 out 12 out 11 out 10 out 9 out 8 out 7 out 6 out 5 out 4 out 3 out 2 out 1 out 0
analog integrated circuit device data 14 freescale semiconductor 33996 logic commands and registers introduction based on output drain-to-source voltage (v ds ) > 2.7 v. this feature is designed to provid e protection to loads that experience more than expected currents and require fast shutdown. the 33996 is designed to operate in both modes with full device protection. pwm enable register the pwm enable register dete rmines the outputs that are pwm controlled. the first 8 bits of the 24 bit spi message word are used to identify the pwm enable command, and the remaining 16 bits are used to enable and disable the pwm of the output drivers. a logic [0] in the pwm enable register will disable the outputs as pwm. a logic [1] in the pwm enable register will set the specific output as a pwm. power-on reset or the rst pin or the reset command will set the pwm enable register to logic [0]. and/or control register the and /or control register describes the condition by which the pwm pin controls the output driver. a logic [0] in the and /or control register will and the pwm input pin with the on /off control register bit. likewise, a logic [1] in the and /or control register will or the pwm input pin with the on /off control register bit (see figure 12 ). for the and / or control to occur, the pwm enable bit must be set to logic [1]. figure 12. pwm control logic diagram serial output (so) response register fault reporting is accomplished through the spi interface. all logic [1s] received by the mcu via the so pin indicate fault. all logic [0s] received by the mcu via the so pin indicate no fault. all fault bits are cleared on the positive edge of cs . so bits 15 to 0 represent the fault status of outputs 15 to 0. so bits 21 to 16 will always return logic [0]. bit 22 provides over-voltage condition status and bit 23 is set when any fault is present in the ic. the timing between two write words must be greater than 450 s to allow adequate time to sense and report the proper fault status. reset command the reset command turns all outputs off and sets the following registers to a por state (refer to table 6 ). ? on/off control register ? sfpd control register ? pwm enable register ? and/or control register the open load current enable and the global shutdown registers are not affected by the reset command. on/off control bit on/off control bit pwm in pwm in and/or control bit on/off control bit pwm enable bit to gate control
analog integrated circuit device data freescale semiconductor 15 33996 typical applications introduction typical applications power consumption the 33996 has been designed with one sleep mode and one operational mode. in sleep mode (so pwr 2.0 v) the current consumed by the vpwr pin is less than 10 a. to place the 33996 in sleep mode, turn all outputs off and remove power from the sopwr pin. during normal operation, 500 a is drawn from the so pwr supply and 8.0 ma from the v pwr supply. paralleling of outputs using mosfets as output swit ches allows the connection of any combination of outputs together. the r ds(on) of mosfets has an inherent posit ive temperature coefficient, providing balanced current sh aring between outputs without destructive operation. this mode of operation may be desirable in the event the application requires lower power dissipation or the added capability of switching higher currents. performance of para llel operation results in a corresponding decrease in r ds(on) , while the output current limit increases correspondingly. output off open load detect current may increase based on how the output off open load detect is programmed. paralleling outputs from two or more different ic devices is possible but not recommended. care must be taken when paralleling outputs for inductive loads. the output voltage cla mp of the output drivers may not match. one mosfet out put must be capable of the inductive energy from the load turn off. spi integrity check checking the integrity of the spi communication is recommended upon initial power- up of the sopwr pin. after initial system start-up or re set, the mcu writes one 48-bit pattern to the 33996. the first 24 bits read by the mcu is the fault status of the outputs, while the second 24 bits is the first bit pattern sent. by the mcu receiving the same bit pattern it sent, bus integrity is confirmed. please note the second 24 bits the mcu sends to the 33996 are the command bits and will program registers or activate outputs on the rising edge of cs . output off open load fault an output off open load fault is the detection and reporting of an open load when the corresponding output is disabled (input bit programmed to a logic low state). the output off open load fault is detected by comparing the drain-to-source voltage of the s pecific mosfet output to an internally generated reference. each output has one dedicated comparator for this purpose. each 33996 output has an internal 50 a pull-down current source. the pull-down current is disabled on power- up and must be enabled for open load detect to function. once enabled, the 33996 will only shut down the pull-down current in sleep mode or when disabled via spi. during output switching, especi ally with capacitive loads, a false output off open load fault may be triggered. to prevent this false fault from bei ng reported, an internal fault filter of 100 s to 450 s is incorporated. the duration for which a false fault may be reported is a function of the load impedance, r ds(on) , c out of the mosfet, as well as the supply voltage, v pwr . the rising edge of cs triggers the built- in fault delay timer. the timer must time out before the fault comparator is enabled to detect a faulted threshold. once the condition causing the open load fault is removed, the device resumes normal operation. the open load fault, however, will be latched in the output so response register for the mcu to read. shorted load fault a shorted load (overcurrent) fault can be caused by any output being shorted directly to supply, or by an output experiencing a current great er than the current limit. three safety circuits progressively in operation during load short conditions afford system protection: 1. the device?s output current is monitored in an analog fashion using a sensefet approach and is current limited. 2. with the output in curren t limit, the drain-to-source voltage will increase. by setting the sfpd bit to 0, the output will shut down on v ds > 2.7 v typical after 450 s. 3. the device?s output thermal limit is sensed and when attained causes only the s pecific faulted output to shutdown. the device remains off until cooled. the device then operates as programmed by the shutdown/ retry bit. the cycle continues until the fault is removed or the command bit instructs the output off. all three protection schemes set the fault status bit (bit 23 in the so response register) to logic [1]. undervoltage shutdown an under voltage so pwr condition results in the global shutdown of all outputs and reset of all control registers. the under voltage threshold is between 2.0 v and 3.0 v. an under voltage condition at the vpwr pin results in an output shutdown and reset. the under voltage threshold is between 3.2 v and 3.5 v. when v pwr is between 5.0 v and 3.5 v, the output may operate per the command word and the status is reported on so pin, though this is not guaranteed. output voltage clamp each output of the 33996 incorporates an internal voltage clamp to provide fast turn-off and transient protection of each output. each clamp indep endently limits the drain-to- source voltage to 50 v. the total energy clamped (e j ) can be
analog integrated circuit device data 16 freescale semiconductor 33996 typical applications introduction calculated by multiplying the current area under the current curve (i a ) times the clamp voltage (v cl ) (see figure 13 ). characterization of the output clamps, using a single pulse non-repetitive method at 0.3 a, indicates the maximum energy to be 50 mj at 150 c junction temperature per output. figure 13. output voltage clamping reverse battery protection the 33996 device requires external reverse battery protection on the vpwr pin. all outputs consist of a power mosfet with an integral substrate diode. during reverse battery condition, current will flow through the load via the substrate diode. under this circumstance relays may energize and lamps will turn on. if load reverse battery protection is desired, a diode must be placed in series with the load. overtemperature fault overtemperature detect circuits are specifically incorporated for each individual output. the shutdown following an over temperature condition depends on the control bit set in the global shutdown / retry control register. each independent output shuts down at 155c to 180c. when an output shuts down due to an overtemperature fault, no other outputs are affe cted. the mcu recognizes the fault by a logic [1] in the fault status bit (bit 23 in the so response register). after the 33996 has cooled below the switch point temperature and 10 c hysteresis, the output will function as defined by the shutdown / retry bit 17 in the global shutdown/retry control register. curren t area (i a ) cla m p e nerg y (e j = i a x v cl ) dr a in vo l tag e time drain-to-source c lamp voltage (v cl = 45 v) drain cu rre nt (i d = 0.3 a) gnd drain-to-source on voltage (v ds(o n) ) 50 v) drain-to-source clamp voltage (v cl = 50 v) drain-to-source on voltage (v ds(on) ) drain voltage clamp energy (e j = i avg x v cl ) gnd time drain current (i d = 0.3 a)
analog integrated circuit device data freescale semiconductor 17 33996 package dimensions introduction package dimensions important : for the most current package revision, visit www.freescale.com and search on keyword for 98a number listed below. ek suffix (pb-free) 32-pin soicw ep 98arl10543d revision b
analog integrated circuit device data 18 freescale semiconductor 33996 package dimensions (continued) introduction package dimensions (continued) ek suffix (pb-free) 32-pin soicw ep 98arl10543d revision b
analog integrated circuit device data freescale semiconductor 19 33996 additional documentation thermal addendum (rev 2.0) additional documentation thermal addendum (rev 2.0) introduction this thermal addendum is provided as a supplement to the mc33996 technical datasheet. the addendum pr ovides thermal performance information that may be critical in the design and development of system appl ications. all electrical, application, and packaging information is provided in the datasheet. packaging and thermal considerations the mc33996 is offered in a 32 pin soicw exposed pad, single die package. there is a single heat source (p), a single junction temperature (t j ), and thermal resistance (r ja ). the stated values are solely for a thermal performance comparison of one package to another in a standardized envir onment. this method ology is not meant to and will not predict the performance of a package in an application-specific environment. stated values were obtained by measurement and simulation according to the standards listed below. standards figure 14. surface mount for soicw exposed pad 32-pin soicw-ep 33996ek ek (pb-free) suffix 98arl10543d 32-pin soicw-ep note for package dimensions, refer to the 33996 data sheet. t j = r ja . p table 7. thermal performance comparisons thermal resistance [ c/w] r ja (1) , (2) 29 r jb (2) , (3) 9.0 r ja (1) , (4) 69 r jc (5) 2.0 notes: 1. per jedec jesd51-2 at natural convection, still air condition. 2. 2s2p thermal test board per jedec jesd51-5 and jesd51-7. 3. per jedec jesd51-8, with the board temperature on the center trace near the center lead. 4. single layer thermal test board per jedec jesd51-3 and jesd51-5. 5. thermal resistance between the die junction and the exposed pad surface; cold plate attached to the package bottom side, remaining surfaces insulated. 1.0 1.0 0.2 0.2 *all measurements are in millimeters 32 pin soicw-ep 0.65 pitch 11.0 mm x 7.5mm body 4.6 mm x 5.7 mm exposed pad
analog integrated circuit device data 20 freescale semiconductor 33996 additional documentation thermal addendum (rev 2.0) figure 15. thermal test board device on thermal test board table 8. thermal resistance performance r ja is the thermal resistance between die junction and ambient air . 33996 pin connections 32-pin soicw ep 0.65 mm pitch 11.0 mm x 7.5 mm body a out15 1 out12 rst gnd gnd gnd gnd so out11 out10 out9 out8 si out13 out14 pwm out0 out3 vpwr gnd gnd gnd gnd sclk out4 out5 out6 out7 cs out2 out1 sopwr 8 9 10 11 12 13 14 15 16 3 4 5 6 7 2 32 25 24 23 22 21 20 19 18 17 30 29 28 27 26 31 4.6 x 5.7 mm exposed pad material: single layer printed circuit board fr4, 1.6 mm thickness cu traces, 0.07 mm thickness outline: 80 mm x 100 mm board area, including edge connector for thermal testing area a: cu heat-spreading areas on board surface ambient conditions: natural convection, still air a [mm 2 ] r ja [ c/w] 0 70 300 49 600 47
analog integrated circuit device data freescale semiconductor 21 33996 additional documentation thermal addendum (rev 2.0) figure 16. device on thermal test board r ja figure 17. transient thermal resistance r j a , 1 w step response, device on thermal test board area a = 600 (mm 2 ) 0 10 20 30 40 50 60 70 80 heat spreading area a [mm2] thermal resistance [oc/w ] 0 300 600 r ja [ c/w] x 0.1 1 10 100 1.00e-03 1.00e-02 1.00e-01 1.00e+00 1.00e+01 1.00e+02 1.00e+03 1.00e+04 time[s] thermal resistance [oc/w ] r ja [ c/w] x
analog integrated circuit device data 22 freescale semiconductor 33996 revision history revision history revision date description of changes 3.0 12/2005 ? implemented revision history page ? changed static electrical table, i pwr (ss) min characteristics, from ?-10? to ?-?. 4.0 9/2006 ? added thermal addendum 5.0 4/2007 ? minor labeling corrections to 33996 simplified internal block diagram on page 2 - changed pins sclk to cs and csb to sclk. ? removed peak package reflow temperature during reflow (solder reflow) parameter from maximum ratings on page 4 . added note with instructions from www.freescale.com. ? added the ek package type to the included thermal addendum. 6.0 6/2007 ? added MCZ33996EK/r2.
mc33996 rev. 6.0 6/2007 rohs-compliant and/or pb-free versions of freescale products have the functionality and electrical characteristics of thei r non-rohs-compliant and/or non-pb-free counterparts. for further information, see http://www.freescale.com or contact your freescale sales representative. for information on freescale?s environmental products program, go to http:// www.freescale.com/epp . information in this document is provided solely to enable system and software implementers to use freescale semiconduc tor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does freescale semiconductor assume any liability ar ising out of the application or use of any product or circuit, and specifically discl aims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data s heets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale se miconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the fa ilure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconductor products for any such unintended or unauthorized application, buyer shall indemni fy and hold freescale semiconductor and its officers, employees, subsidiaries, affili ates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale? and the freescale logo are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? freescale semiconductor, inc., 2007. all rights reserved. how to reach us: home page: www.freescale.com web support: http://www.freescale.com/support usa/europe or locations not listed: freescale semiconductor, inc. technical information center, el516 2100 east elliot road tempe, arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33 1 69 35 48 48 (french) www.freescale.com/support japan: freescale semiconductor japan ltd. headquarters arco tower 15f 1-8-1, shimo-meguro, meguro-ku, tokyo 153-0064 japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com asia/pacific: freescale semiconductor hong kong ltd. technical information center 2 dai king street tai po industrial estate tai po, n.t., hong kong +800 2666 8080 support.asia@freescale.com for literature requests only: freescale semiconductor literature distribution center p.o. box 5405 denver, colorado 80217 1-800-441-2447 or 303-675-2140 fax: 303-675-2150 ldcforfreescalesemiconductor@hibbertgroup.com


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